| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device capable of suppressing a temperature rise of a substrate.SOLUTION: A film forming device includes a film forming unit 20 for emitting particles containing a film forming material FM toward a substrate S, a cooling unit for cooling a cooling member 33, and an arranging unit 10 for arranging the substrate S apart from and opposite to the cooling member 33, and further includes a vacuum chamber for holding the cooling member 33. The cooling unit cools the cooling member 33 to a temperature at which the vapor pressure of a gas contained in the vacuum chamber is higher than the pressure in the vacuum chamber. |
