发明名称 |
THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer. |
申请公布号 |
US2014145814(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201314086152 |
申请日期 |
2013.11.21 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SANG MOON;BAE JUN HEE;WI SUNG KWON;KIM YONG SUK |
分类号 |
H01F27/28 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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