发明名称 SILICON CARBIDE SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a silicon carbide semiconductor device having a long carrier lifetime without performing an additional process after manufacturing an SiC single crystal substrate by a chemical vapor deposition method.SOLUTION: A silicon carbide semiconductor device manufacturing method comprises: adjusting a temperature inside a reaction furnace to 1700°C (step S5); subsequently, introducing a material gas, an added gas, a doping gas and a carrier gas into the reaction furnace (step S6); subsequently, growing an SiC epitaxial film on a surface of a 4H-SiC substrate by a CVD method (step S7); subsequently, cooling the 4H-SiC substrate on which the SiC epitaxial film is stacked in an atmosphere of a hydrogen gas diluted methyl methane gas until the temperature inside the reaction furnace decreases from 1700°C to 1300°C (step S8); and subsequently, cooling the 4H-SiC substrate on which the SiC epitaxial film is stacked in a hydrogen gas atmosphere until the temperature inside the reaction furnace decreases to a temperature lower than 1300°C (step S9).
申请公布号 JP2014099483(A) 申请公布日期 2014.05.29
申请号 JP20120249763 申请日期 2012.11.13
申请人 FUJI ELECTRIC CO LTD 发明人 KAWADA YASUYUKI;YONEZAWA YOSHIYUKI
分类号 H01L21/205;C23C16/42;C30B25/20;C30B29/36;H01L21/336;H01L29/12;H01L29/78 主分类号 H01L21/205
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