发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device which has a small S value and inhibits decrease in an on-state current and which is highly responsive.SOLUTION: In a semiconductor device manufacturing method, a semiconductor layer in which a film thickness of a source region or a drain region is thicker than a film thickness of a channel formation region is formed. A manufacturing method of the semiconductor device using such semiconductor layer comprises: forming a first semiconductor layer on a substrate; forming a first insulation layer and a conductive layer on the first semiconductor layer; forming a second insulation layer on lateral faces of the conductive layer; forming a second semiconductor layer on the first insulation layer, the conductive layer and the second insulation layer; and forming the semiconductor layer having an uneven shape by etching the second semiconductor layer by using a resist partially provided as a mask and performing a heat treatment on the first semiconductor layer and the second semiconductor layer.</p>
申请公布号 JP2014099640(A) 申请公布日期 2014.05.29
申请号 JP20140005841 申请日期 2014.01.16
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 ONUMA HIDETO
分类号 H01L29/786;H01L21/20;H01L21/336 主分类号 H01L29/786
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