发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device which has a small S value and inhibits decrease in an on-state current and which is highly responsive.SOLUTION: In a semiconductor device manufacturing method, a semiconductor layer in which a film thickness of a source region or a drain region is thicker than a film thickness of a channel formation region is formed. A manufacturing method of the semiconductor device using such semiconductor layer comprises: forming a first semiconductor layer on a substrate; forming a first insulation layer and a conductive layer on the first semiconductor layer; forming a second insulation layer on lateral faces of the conductive layer; forming a second semiconductor layer on the first insulation layer, the conductive layer and the second insulation layer; and forming the semiconductor layer having an uneven shape by etching the second semiconductor layer by using a resist partially provided as a mask and performing a heat treatment on the first semiconductor layer and the second semiconductor layer.</p> |
申请公布号 |
JP2014099640(A) |
申请公布日期 |
2014.05.29 |
申请号 |
JP20140005841 |
申请日期 |
2014.01.16 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ONUMA HIDETO |
分类号 |
H01L29/786;H01L21/20;H01L21/336 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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