发明名称 ADHESIVE COMPOSITION FOR PEELABLE PRESSURE SENSITIVE ADHESIVE LABEL
摘要 <p>PROBLEM TO BE SOLVED: To provide a hot melt pressure sensitive adhesive (HMPSA) composition; a layer of the HMPSA composition; a multilayer system having a printable supporting layer and an adjacent protective layer; a corresponding self-adhesive label; and a method for recycling an article with a label comprising immersing an article in a high-temperature aqueous basic solution to peel a label.SOLUTION: A hot melt pressure sensitive adhesive (HMPSA) composition comprises the following (a) to (c): (a) 25 to 50 wt.% of a mixture of SBS-type and SB-type styrene block copolymers; (b) 45 to 75 wt.% of a compatible tackifying resin having a softening temperature of 80 to 150°C; and (c) 0.5 to 5.5 wt.% of a fatty acid having a hydrocarbon chain having 10 to 22 carbon atoms.</p>
申请公布号 JP2014098155(A) 申请公布日期 2014.05.29
申请号 JP20130258708 申请日期 2013.12.13
申请人 BOSTIK SA 发明人 STEPHANE ANDRE FOUQUAY;DAVID GOUBARD
分类号 C09J153/02;B32B7/06;B32B27/30;B65D23/00;C09J7/02;C09J11/06;C09J11/08;C09J193/00;G09F3/10 主分类号 C09J153/02
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