发明名称 COIL COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a coil component ensuring high bond strength with less adhesive, with regard to the bonding of a drum core and a planar core.SOLUTION: A common mode filter 10 includes a drum core 11 having a winding core 11a and a pair of flanges 11b, 11c provided at both ends of the winding core 11a, a planar core 12 having a lower surface 12b facing the upper surfaces 11bt, 11ct of the pair of flanges 11b, 11c, respectively, an adhesive 20 for bonding the drum core 11 and the planar core 12, and wires W1, W2 wound around the winding core 11a. Edges of the upper surfaces 11bt, 11ct in the x-direction face the lower surface 12b of the planar core 12 via a gap becoming narrower from the edge of the upper surface toward the center thereof. The adhesive 20 is arranged in the gap, and the drum core 11 and planar core 12 come into direct contact with no adhesive 20 interposed therebetween, in the center of the upper surfaces 11bt, 11ct in the x-direction.</p>
申请公布号 JP2014099587(A) 申请公布日期 2014.05.29
申请号 JP20130122438 申请日期 2013.06.11
申请人 TDK CORP 发明人 TAKAGI NOBUO;TSUCHIDA SETSU;SUDO TOMONAO
分类号 H01F17/04;H01F27/06;H01F27/24;H01F27/26 主分类号 H01F17/04
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