发明名称
摘要 Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
申请公布号 JP2014513434(A) 申请公布日期 2014.05.29
申请号 JP20140508469 申请日期 2012.04.23
申请人 发明人
分类号 H01L21/304;B24B37/005;B24B37/34 主分类号 H01L21/304
代理机构 代理人
主权项
地址