| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-frequency circuit module having a high packaging density.SOLUTION: A high-frequency circuit module 100 comprises: an RFIC 160 performing processes of transmitting and receiving a high-frequency signal; a power amplifier IC 155 amplifying a transmission signal from the RFIC 160; and duplexers 110 and 120 separating a transmission signal outputted from the power amplifier IC 155 to an antenna and a reception signal inputted to the RFIC 160 from the antenna from each other. Any one or both of the RFIC 160 and the power amplifier IC 155 are buried in a circuit board 200, and the duplexers 110 and 120 are arranged between the RFIC 160 and the power amplifier IC 155.</p> |
