发明名称 |
Semiconductor Device Components and Methods |
摘要 |
Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end. |
申请公布号 |
US2014145194(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201414166686 |
申请日期 |
2014.01.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN BI-LING;LIN JIAN-HONG;HSIEH MING-HONG;CHEN LEE-DER;SHIH JIAW-REN;CHIU CHWEI-CHING |
分类号 |
H01L23/525;H01L21/66;H01L23/522 |
主分类号 |
H01L23/525 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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