发明名称 |
PRINTED BOARD AND METHOD OF MANUFACTURING PRINTED BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed board capable of stably holding a thermally conductive member even under a vibration environment, and a method of manufacturing a printed board.SOLUTION: The printed board is used which includes: an insulating substrate provided with at least one through hole; a conductor pattern layer formed on both surfaces of the insulating substrate; a first metal plating layer covering an inner wall of the through hole and the conductor pattern layer formed on both surfaces of the insulating substrate; a metal thermally conductive member arranged in the through hole so as to be in close contact with the first metal plating layer; and a second metal plating layer formed on both surfaces of the insulating substrate so as to continuously cover the conductor pattern layer and an end surface of the thermally conductive member.</p> |
申请公布号 |
JP2014099543(A) |
申请公布日期 |
2014.05.29 |
申请号 |
JP20120251127 |
申请日期 |
2012.11.15 |
申请人 |
SHIRAI ELECTRONICS INDUSTRIAL CO LTD |
发明人 |
MOCHIZUKI RYOTA;OKADA KOICHI;NAKAZAWA AYAKA |
分类号 |
H05K1/02;H05K1/11;H05K3/40 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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