发明名称 PRINTED BOARD AND METHOD OF MANUFACTURING PRINTED BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed board capable of stably holding a thermally conductive member even under a vibration environment, and a method of manufacturing a printed board.SOLUTION: The printed board is used which includes: an insulating substrate provided with at least one through hole; a conductor pattern layer formed on both surfaces of the insulating substrate; a first metal plating layer covering an inner wall of the through hole and the conductor pattern layer formed on both surfaces of the insulating substrate; a metal thermally conductive member arranged in the through hole so as to be in close contact with the first metal plating layer; and a second metal plating layer formed on both surfaces of the insulating substrate so as to continuously cover the conductor pattern layer and an end surface of the thermally conductive member.</p>
申请公布号 JP2014099543(A) 申请公布日期 2014.05.29
申请号 JP20120251127 申请日期 2012.11.15
申请人 SHIRAI ELECTRONICS INDUSTRIAL CO LTD 发明人 MOCHIZUKI RYOTA;OKADA KOICHI;NAKAZAWA AYAKA
分类号 H05K1/02;H05K1/11;H05K3/40 主分类号 H05K1/02
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