发明名称 |
INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR |
摘要 |
An insulating paste includes insulating particles 311, Si particles 312 and an organic Si compound 320. The organic Si compound 320 reacts with the Si particles 312 to form a Si—O bond filling up the space around the insulating particles 311. |
申请公布号 |
US2014147578(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201314085377 |
申请日期 |
2013.11.20 |
申请人 |
NAPRA CO., LTD. |
发明人 |
SEKINE SHIGENOBU;SEKINE YURINA |
分类号 |
H01B3/18;H01B13/06 |
主分类号 |
H01B3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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