| 摘要 |
A wireless module includes a first board (2), in which an electronic component is mounted on one board (2a) and a ground layer (GND1) is formed on the other board (2b), a second board (3) which is laminated on the first board, a connecting member (8) which electrically connects the first board to the second board, a wiring pad (4) which electrically connects the first hoard to the connecting member, and a wiring pad (4b) which is provided on a bonded surface of the one board and the other board. A signal path of the connecting member has predetermined impedance which is determined depending on a distance between the second wiring pad and the ground layer. |
