发明名称 |
Systems For The Recycling of Wire-Saw Cutting Fluid |
摘要 |
A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation. |
申请公布号 |
US2014145309(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201213684812 |
申请日期 |
2012.11.26 |
申请人 |
(UEN200614797D) MEMC SINGAPORE, PTE. LTD;MEMC SINGAPORE, PTE. LTD (UEN200614797D) |
发明人 |
GRABBE ALEXIS;KWESKIN SASHA JOSEPH;SHIVE LARRY WAYNE;ERK HENRY FRANK |
分类号 |
F28F19/01;H01L29/34 |
主分类号 |
F28F19/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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