| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silver-free and lead-free solder composition that can improve the tensile strength, bonding strength, and wetting capability, and that can reduce manufacturing costs.SOLUTION: A silver-free and lead-free solder composition includes: 2 wt.% to 8 wt.% of Bi, 0.1 wt.% to 1.0 wt.% of Cu, 0.01 wt.% to 0.2 wt.% of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt.% of the silver-free and lead-free solder composition.</p> |
