ENCAPSULATION FILM FOR OLED HAVING HEAT SINK LAYER
摘要
<p>The present invention provides an encapsulation film for an OLED having a heat radiation layer which comprises: a base film; a heat radiation layer formed on the bottom surface of the base film; a barrier layer which is formed on the upper surface of the base film and has a lattice-shaped barrier; and an OLED substrate which is formed on the upper surface of the barrier layer and includes an OLED element in the bottom surface.</p>
