发明名称 |
Substrate recycling method and recycled substrate |
摘要 |
Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, after the first etching, a second etching of the first surface using chemical etching, dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface. |
申请公布号 |
EP2736068(A2) |
申请公布日期 |
2014.05.28 |
申请号 |
EP20130193574 |
申请日期 |
2013.11.19 |
申请人 |
SEOUL VIOSYS CO., LTD. |
发明人 |
CHOI, JOO WON;KIM, CHANG YEON;HEO, JEONG HOON;KIM, YOUNG WUG;HONG, SU YEON;RYU, SANG WAN |
分类号 |
H01L21/306;H01L21/02;H01L33/00 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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