发明名称 method for manufacturing light emitting device and the device thereby
摘要 <p>The present invention relates to a method for manufacturing an optical device and to an optical device manufactured by the method, in which heat-dissipating performance by a heat sink and thermal insulation performance between a substrate and the heat sink are improved and workability is enhanced. According to a first characteristic of the present invention, the method for manufacturing an optical device comprises: (a) a step of preparing a disk for an optical device having a vertical thermal insulation layer; (b) a step of forming a groove along a cut line formed on the lower surface of the disk for an optical device; (c) a step of applying liquid insulation material to the surface on which the groove is formed and hardening the liquid insulation material to form an electrically insulating layer having a planar surface; and (d) a step of forming a fixing hole penetrating in a vertical direction through both the disk for an optical device and the groove.</p>
申请公布号 KR101400271(B1) 申请公布日期 2014.05.28
申请号 KR20120130777 申请日期 2012.11.19
申请人 发明人
分类号 H01L33/48;H01L33/52;H01L33/64 主分类号 H01L33/48
代理机构 代理人
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