| 摘要 |
A method for forming an electrode of an LED package according to the present invention comprises: a first step of preparing a submount having a via hole; a second step of forming at least one intermediate layer on an upper surface and a lower surface of the submount and in the via hole while a material of forming the intermediate layer flows along the upper surface and the lower surface of the submount and the inner circumference of the via hole by flowing at least one material of forming the intermediate layer, which is formed in a gaseous state by a chemical vapor deposition process, to the upper surface and the lower surface of the submount and to the inside the via hole; and a third step of plating copper on the intermediate layer to respectively form an upper electrode and a lower electrode on the upper surface and the lower surface of submount and filling the inside the via hole with the copper of connecting the upper electrode and the lower electrode. |
