| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy adhesive composition capable of surely bonding a metal having an oxide film on the surface while removing the oxide film of the metal without using a flux. SOLUTION: The epoxy adhesive composition for the bonding of a metal having an oxide film on the surface contains an epoxy resin and a water-insoluble organic acid. The pH of the composition is <5 before curing and is 6-8 in cured state, and the reaction ratio in curing obtained by the heat release determined by DSC is≥90%. COPYRIGHT: (C)2007,JPO&INPIT |
