发明名称 |
White heat-curable silicone resin composition and optoelectronic part case |
摘要 |
<p>A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.</p> |
申请公布号 |
EP2135898(B1) |
申请公布日期 |
2014.05.28 |
申请号 |
EP20090007554 |
申请日期 |
2009.06.08 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TAGUCHI, YUSUKE;SAWADA, JUNICHI |
分类号 |
C08L83/04;C08K3/00;C08K3/22;C08K5/09;C08K5/3492;C08K5/54;C08L83/06;H01L31/0203;H01L33/48;H01L33/50;H01L33/60 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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