WAFER TRANSFER APPARATUS

摘要

The present invention relates to a wafer transfer device capable of reducing damage to wafers because positions where the underside of the wafers comes in contact are not stepped in the transfer and printing processes of the wafers, and facilitating the maintenance and repair of the device by separating only roll papers to replace when the roll papers are contaminated by repeated works. The wafer transfer device comprises nest modules and motion modules. Each nest module comprises: a vacuum chuck; a pair of paper rollers arranged under the vacuum chuck; shaft driving wheels arranged in one side of the paper rollers to provide driving force to the paper rollers; and a roll paper having both ends coupled to the paper rollers to be wound or unwound, and one surface coming in contact with the upside of the vacuum chuck. Each motion module comprises: a slider vertically lifted up and down; nest driving wheels arranged above the slider to come in contact with or be separated from the shaft driving wheels while the slider lifts up and down; and a driving motor for providing driving force to the nest driving wheels.