发明名称
摘要 <p>According to an embodiment of the invention, a semiconductor device includes a substrate, a second conductive type source region formed in the substrate, a second conductive type drain region formed in the substrate, a first conductive type channel region formed in the substrate, a second conductive type drift region formed between the first conductive type channel region and the second conductive type drain region, an insulator film buried on a surface of the second conductive type drift region, and a gate electrode including an opening between the first conductive type channel region and the insulator film and covering a surface of the substrate from the first conductive type channel region to part of the insulator film via a gate insulator. The second conductive type drift region includes a second portion of the second conductive type drift region formed in the substrate below the opening.</p>
申请公布号 JP5504187(B2) 申请公布日期 2014.05.28
申请号 JP20110014270 申请日期 2011.01.26
申请人 发明人
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
代理机构 代理人
主权项
地址