| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure for an electronic part with which a heat-generating electronic part is adhesively fixed to an existing substrate while the coating amount of adhesive agent is regulated, whereby a desired heat radiation effect can be expected.SOLUTION: A heat radiation structure comprises a substrate and a heat sink fixed to the back surface of the substrate. A boundary line is set on the surface of the substrate so that the boundary line is spaced outwardly at a predetermined insulating distance from an outer periphery with which a heating electronic part to be mounted comes into contact and surrounds the outer periphery. Copper foil pattern is applied to only the whole surface at the outside of the boundary line, and the substrate surface of the whole surface at the inside of the boundary line is exposed. A place at which adhesive agent is applied and an indication specifying the coating amount of the adhesive agent are silk-printed on the substrate surface at the inside of the outer periphery. |
