发明名称
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad and method for manufacturing the same, capable of improving the flatness of an object to be polished by improving a polishing rate.SOLUTION: The polishing pad 10 includes longitudinal foams 3 in the thickness direction and a foam body 2 formed with continuous foams 5 therein by the wet film formation method. The foamed body 2 has a region 2a formed with an opening 4 having an opening diameter of 30 μm or less by opening the foam 3 and a region 2b formed with an opening 6 having an opening diameter of 50 μm or more by opening the foam 5, in a polishing surface P. The region 2a and the region 2b are arranged to form a stripe-like pattern in the polishing surface P. During a polishing process, an object to be polished is completely polished in the region 2a and slurry outflow and inflow are promoted in the region 2b.
申请公布号 JP5502560(B2) 申请公布日期 2014.05.28
申请号 JP20100082255 申请日期 2010.03.31
申请人 发明人
分类号 B24B37/24;B24B37/26;H01L21/304 主分类号 B24B37/24
代理机构 代理人
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