| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide soluble in organic solvents and suitably usable as an overcoating material for a flexible wiring substrate, an interlayer insulation material, etc., excellent in heat-resistance, electrical properties, flexibility, etc., a photosensitive polyimide ink composition containing the photosensitive polyimide, and an insulating film produced by curing the photosensitive polyimide ink composition. <P>SOLUTION: There are provided the photosensitive polyimide soluble in organic solvents and obtained from a polyimide synthesized by reaction of an acid dianhydride component composed mainly of a specific alicyclic tetracarboxylic acid dianhydride with a diamine component composed mainly of a specific aromatic diamine having two carboxyl groups in one molecule, by addition reaction or condensation reaction of a compound having a (meth)acryloyl group to a part of the carboxyl group of the polyimide; and the photosensitive polyimide ink and the insulating film produced by using the photosensitive polyimide. <P>COPYRIGHT: (C)2010,JPO&INPIT |
