Method for detaching semiconductor chip from foil, involves assigning process step to last frame assigned time/derived time period while showing that no edge region in image of chip is darker than predetermined brightness value

摘要

The method involves determining a portion of semiconductor chip (3A,3B) sticking to foil, and bending determined portion of semiconductor chip. A light is impinged to the surface of semiconductor chip to be removed. An image of semiconductor chip is captured, and checked whether an edge region (14) in image of semiconductor chip is darker than predetermined brightness value. The process step is assigned to last frame assigned time or derived time period while showing that no edge region in image of the semiconductor chip is darker than predetermined brightness value.