SIDE LIGHT EMITTING LED PACKAGE, LIGHTING ARRAY MODULE, AND FABRICATION METHOD THEROF

摘要

The present invention relates to a side light emitting LED package, a lighting array module using the same and a method for manufacturing the same. The method for manufacturing a lighting array module according to the present invention includes: a first step of forming a substrate including N number of LED package substrates; a second step of arranging N number of LED chips on the N number of LED package substrates; a third step of electrically connecting a first conductive pattern of the LED package substrate with a first conductive electrode exposed to the upper surface of the LED chip and electrically connecting a second conductive pattern of the LED package substrate with a second conductive electrode exposed to the upper surface of the LED chip; a fourth step of forming a fluorescent layer to include the upper surface of the substrate and the side surface and the upper surface of the LED chip in the front surface of the substrate; a fifth step of cutting the substrate in a unit of the N number of LED package substrates and forming N number of side light emitting LED packages; and a sixth step of arranging the multiple side light emitting LED packages to be spaced apart from each other on a lighting array substrate in a method for electrically connecting connection electrodes of the lighting array substrate with a first connection pad which is electrically connected to the first conductive pattern of the side light emitting LED package and a second connection pad which is electrically connected to the second conductive pattern of the side light emitting LED package.