| 摘要 |
The assembly has a cooling body (1) comprising a box-shaped base body and soldering lugs (3, 5) that are soldered into respective apertures (4, 6) of a copper-covered printed circuit board (2) by a gush process by using a no clean fluxing agent. The cooling body is provided with an aluminum body made from aluminum sheet, and the soldering lugs are covered with a nickel layer. The apertures are formed as edged holes, and the cooling body comprises a long bracket and a short bracket, where the short bracket is designed as a support. An independent claim is also included for a mounting method for manufacturing a heat sink assembly. |
