| 摘要 |
<p>The present invention relates to a thin film encapsulation for an organic electronic device, an encapsulation product for an organic electronic device including the same, and a method for encapsulating an organic electronic device. The thin film encapsulation, which has the excellent gas and moisture barrier properties, can be effectively used in various products for which protection is required from oxygen or steam. In particular, the thin film encapsulation can be applied to an encapsulation or a device substrate of a display device such as an organic electronic device, etc. which are weak to oxygen or steam, thereby remarkably improving the lifespan and durability thereof.</p> |
