| 摘要 |
The present invention relates to a panel bonding apparatus which automatically and rapidly bonds a plurality of panels which comprise a panel product. A panel bonding apparatus of the present invention includes a panel carrier and a panel bonder. The panel carrier includes: a rotational support bar which is arranged to separate a plurality of panel carrying jigs which are mounted to place a first panel of which one side face downward; and a rotational support bar rotation apparatus for transferring the panel carrying jigs along a horizontal rotation path which is horizontal to the ground surface by intermittently rotating the rotation support bar. The panel bonder includes: a moving frame; a panel compression plate which is pivot-coupled by a pivot shaft to the moving frame; a pressurization roller which is arranged in one end of the panel bonding plate; a pusher for rotating the panel bonding plate by upwardly pushing the panel bonding plate based on the pivot shaft; and a moving frame moving apparatus for moving the moving frame. |
