Automation device with cooling element

摘要

The device has a first electronic component (30b) arranged on a first printed circuit board (32), where the first electronic component is required to be cooled. A heatsink is arranged on a second printed circuit board (31) and formed as cuboid-shaped structure. A first cooling contact surface is incorporated in a first lateral surface of a cuboid. A second cooling contact surface is incorporated in a second lateral surface of the heatsink rests on the first electronic component. A second electronic component (30a) is arranged between the second printed circuit board and the heatsink.