| 摘要 |
<p>A power module package is provided to efficiently discharge the heat by arranging the other end of the lead frame connected to the external terminal on the wiring pattern. A power module package(100) comprises one or more semiconductor chip(150a) for the power controls adhered on a substrate(110); and a low power semiconductor chip(150b) for controlling the semiconductor chips for the power controls. A wiring pattern(130) is formed on the surface of substrate. The first lead frame(170a) is arranged between the wiring pattern and the semiconductor chip for the power control. One end of the first lead frame is connected to the external terminal and the other end of the first lead frame is arranged on the wiring pattern. The other end of the first lead frame is extended in order to be more protruded than the side of the semiconductor chip for the power control on the wiring pattern.</p> |
