| 摘要 |
The present invention relates to an LED package with the enhanced reliability of a package. A contact area between a package body and a cup can widen by adopting a structure of the cup with an expansion part at a sidewall, and a moisture penetration path can lengthen from the bottom of the package body to an LED chip. To this end, the present invention includes an LED chip disposed inside a cavity; a resin part including a package body surrounding the cavity and an encapsulant filled in the cavity; and a lead frame disposed at the bottom of the cavity and electrically connected to the LED chip. The lead frame includes a protrusion part protruding from at least one among the inner surface and outer surface. |
