| 摘要 |
<p>In manufacturing light emitting element packages by coating the top surfaces of LED elements with the resin containing the fluorescent substance, in a resin supplying operation of discharging to supply the resin onto the LED elements in a wafer state, the light emission characteristics of the light that the resin emits when excitation light from a light source part is irradiated onto a light-passing member on which the resin is test supplied for light emission characteristic measurement are measured, and the appropriate resin supply quantity is revised based on the result of the measurement and light emission characteristics prescribed beforehand, to derive an appropriate resin supply quantity of the resin which should be supplied to the LED elements for practical production.</p> |
