| 摘要 |
Disclosed are a substrate treatment device and a substrate treatment method. The substrate treatment device, which is to align substrates and masks to treat the processes for the substrates, comprises: a substrate loading chamber on which a plurality of substrates are sequentially loaded; a substrate transferring chamber to transfer the substrates; first and second align chambers which are branched to both sides from the substrate transferring chamber to align the substrates and the masks; a mask rotating chamber which is connected to the first and second align chambers; a mask loading chamber which has one end connected to the mask rotating chamber to consecutively supply the masks to the mask rotating chamber; and a process chamber which is connected to the other end of the mask loading chamber to perform the substrate processes. The substrate treatment device is able to reduce a total process tact-time and improve the efficiency of the materials used in the process for treating the substrates. |
