发明名称 |
Semiconductor device with vias on a bridge connecting two buses |
摘要 |
A semiconductor device comprises conductive buses and conductive bridges. A respective conductive bridge is conductively coupled to at least two portions of at least one of the conductive buses. At least N plus one (N+1) vias are coupled between every one of the conductive bridges and a respective feature in an integrated circuit when: (1) a width of the respective conductive bridge is less than a width of each of the at least two portions of the at least one of the conductive buses to which the respective conductive bridge is coupled, and (2) a distance along the respective conductive bridge and at least one of the vias is less than a critical distance. N is a number of conductive couplings between the respective one of the conductive bridges and the at least one of the conductive buses. |
申请公布号 |
US8736071(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201113285073 |
申请日期 |
2011.10.31 |
申请人 |
REBER DOUGLAS M.;SHROFF MEHUL D.;TRAVIS EDWARD O.;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
REBER DOUGLAS M.;SHROFF MEHUL D.;TRAVIS EDWARD O. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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