发明名称 |
Front side copper post joint structure for temporary bond in TSV application |
摘要 |
An integrated circuit structure includes a semiconductor substrate; a conductive via (TSV) passing through the semiconductor substrate; and a copper-containing post overlying the semiconductor substrate and electrically connected to the conductive via. |
申请公布号 |
US8736050(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US20100831819 |
申请日期 |
2010.07.07 |
申请人 |
HUANG HON-LIN;HSIAO CHING-WEN;HSU KUO-CHING;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG HON-LIN;HSIAO CHING-WEN;HSU KUO-CHING;CHEN CHEN-SHIEN |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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