发明名称 Stacked structures and methods of forming stacked structures
摘要 A stacked structure includes a first die bonded over a second die. The first die has a first die area defined over a first surface. At least one first protective structure is formed over the first surface, around the first die area. At least one side of the first protective structure has at least one first extrusion part extending across a first scribe line around the protective structure. The second die has a second die area defined over a second surface. At least one second protective structure is formed over the second surface, around the second die area. At least one side of the second protective structure has at least one second extrusion part extending across a second scribe line around the protective structure, wherein the first extrusion part is connected with the second extrusion part.
申请公布号 US8736039(B2) 申请公布日期 2014.05.27
申请号 US20060539481 申请日期 2006.10.06
申请人 WU WENG-JIN;CHIOU WEN-CHIH;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 WU WENG-JIN;CHIOU WEN-CHIH;YU CHEN-HUA
分类号 H01L23/22 主分类号 H01L23/22
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