发明名称 |
Leadless integrated circuit package having standoff contacts and die attach pad |
摘要 |
A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material. |
申请公布号 |
US8736037(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US20100775711 |
申请日期 |
2010.05.07 |
申请人 |
POWELL KIRK;MCMILLAN JOHN;FUNG ADONIS;PEDRON, JR. SERAFIN P.;UTAC HONG KONG LIMITED |
发明人 |
POWELL KIRK;MCMILLAN JOHN;FUNG ADONIS;PEDRON, JR. SERAFIN P. |
分类号 |
H01L23/495;H01L23/28;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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