发明名称 Electronic component fabrication method using removable spacers
摘要 An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
申请公布号 US8732925(B2) 申请公布日期 2014.05.27
申请号 US201213443286 申请日期 2012.04.10
申请人 CHEUNG WILLIAM S. H.;YEN TECHNOLOGIES, LLC 发明人 CHEUNG WILLIAM S. H.
分类号 H01G7/00 主分类号 H01G7/00
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