发明名称 |
Delamination resistant device package having raised bond surface and mold locking aperture |
摘要 |
A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an“up-set”bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. |
申请公布号 |
US8736042(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201113324749 |
申请日期 |
2011.12.13 |
申请人 |
LI FELIX C.;LEE YEE KIM;LIM PENG SOON;YII TERH KUEN;LEE LEE HAN MENG@EUGENE;NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LI FELIX C.;LEE YEE KIM;LIM PENG SOON;YII TERH KUEN;LEE LEE HAN MENG@EUGENE |
分类号 |
H01L23/48;H01L23/495;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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