CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD

摘要

An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film 2 is formed on a base material 1, and the method includes the steps of forming a film 3b composed of copper particulates 4 on a base material, subjecting the film 3b to photo sintering, and applying plating to the photo-sintered film 3c. Whereby, it is possible to form a conductive film 2 on a base material 1 by lowering irradiation energy of light in photo sintering even when the base material 1 has low heat resistance. Since the conductive film 2 includes a plated layer 21, electric resistance decreases.