发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER PREPARED BY USING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE PHOTOSENSITIVE RESIN LAYER
摘要 <p>Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.</p>
申请公布号 KR101400186(B1) 申请公布日期 2014.05.27
申请号 KR20100140593 申请日期 2010.12.31
申请人 发明人
分类号 G03F7/016;G03F7/039;H01L21/027 主分类号 G03F7/016
代理机构 代理人
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