发明名称 CUTTING-LINE FORMATION DEVICE AND CUTTING-LINE FORMATION METHOD
摘要 Provided is a cutting-line formation device that can continuously form cutting lines in an optical film laminate such that the direction of the cutting lines is accurately perpendicular to the side edge part of the optical film laminate. By using a cutting-line formation means, this cutting-line formation device continuously forms, in an optical film laminate, cutting lines in the width direction, which is perpendicular to the length direction of the optical film laminate, while leaving only a carrier film. This device comprises said cutting-line formation means, a first detection means, a second detection means, and a third detection means. The first detection means detects a first section in the side edge part of the optical film laminate. The second detection means detects: a second section in the side edge part, said second section being located downstream of the first section; and one section of the immediately preceding cutting line. The third detection means detects another section of the immediately preceding cutting line, said another section being different from said one section. This device comprises a movement means that moves the cutting-line formation means, the first detection means, the second detection means, and the third detection means while maintaining a predetermined relative positional relationship. A control means controls the driving of the movement means such that the direction of the cutting lines becomes perpendicular to the side edge part of the optical film laminate.
申请公布号 KR20140063811(A) 申请公布日期 2014.05.27
申请号 KR20147009823 申请日期 2013.05.16
申请人 NITTO DENKO CORPORATION 发明人 YURA TOMOKAZU;KOSHIO SATORU;MISHIMA JUN;NAKAICHI MAKOTO;NAKAZONO TAKUYA;MAEDA MINORU
分类号 B26D3/08;B26D1/18;B26D5/00;G02B5/30 主分类号 B26D3/08
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