发明名称 |
Electronic component with metal plate above element and fabrication method of the same, and electronic device including the same |
摘要 |
An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity. |
申请公布号 |
US8736149(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201213712227 |
申请日期 |
2012.12.12 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
INOUE KAZUNORI;IWAKI MASAFUMI;MIYASHITA TSUTOMU;MATSUMOTO KAZUHIRO |
分类号 |
H03H9/25;H03H3/02;H03H9/10 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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