发明名称 |
BUMP-ON-LEADFRAME SEMICONDUCTOR PACKAGE WITH LOW THERMAL RESISTANCE |
摘要 |
<p>In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump</p> |
申请公布号 |
KR20140063603(A) |
申请公布日期 |
2014.05.27 |
申请号 |
KR20147003925 |
申请日期 |
2012.08.12 |
申请人 |
ADVANCED ANALOGIC TECHNOLOGIES, INC. |
发明人 |
LIN KENG HUNG;WILLIAMS RICHARD K. |
分类号 |
H01L23/34;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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