发明名称 Curing resin composition
摘要 A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition. The curing resin composition contains (A) an oxime ester radical initiator represented by general formula (I), where symbols are as defined in the description, (B) a radical curing resin, (C) a latent epoxy curing agent, and (D) an epoxy resin
申请公布号 US8735511(B2) 申请公布日期 2014.05.27
申请号 US201113319788 申请日期 2011.04.20
申请人 SHINANO HIROKATSU;FUKUNAGA HIROYA;ITANO KAZUYUKI;ADEKA CORPORATION 发明人 SHINANO HIROKATSU;FUKUNAGA HIROYA;ITANO KAZUYUKI
分类号 C08F2/50;C07C251/32;C08G59/50;C08G59/68;C08G59/72;C08L63/02;C08L63/04;C08L63/06;C08L63/08;C08L63/10 主分类号 C08F2/50
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