| 摘要 |
The present invention relates to an apparatus for cutting a transparent or translucent film and a cutting method using the same. The cutting method comprises: a film preparation step of putting a film to be cut on an upper surface of a cutting plate (112); a cutting line setting step of setting a cutting line projected by a desired beam projector (150) through information from a data unit (152) when the film preparation step is completed; a color selection step of determining the color of the cutting line to be projected by the beam projector (150) considering the color of the film to be cut when the cutting line setting step is completed; a brightness determination step of determining the brightness of light projected by the beam projector (150) considering the characteristics of the film to be cut when the color selection step is completed; a beam irradiation step of operating the beam projector (150) to project the set cutting line on the cutting plate (112) when the brightness determination step is completed; and a cutting completion step of cutting the film to be cut on the upper surface of the cutting plate (112) using various tools when the beam irradiation step is completed. Thus, a multi-product small-quantity film can be continuously cut without the interference of light as well as accurately cutting a transparent or translucent film by allowing the beam project to project a cutting line according to cutting. |
