| 摘要 |
PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film including the same, and a semiconductor device including the photo-sensitive resin film are provided to overcome film thickness related problems. CONSTITUTION: A positive type photo-sensitive resin composition includes a polybenzoxazole precursor with a repeating unit in the form of random copolymer, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The repeating unit is represented by chemical formula 1. In chemical formula 1, X1 is derived from a diamine compound represented by chemical formula 30; X2 is an aromatic organic group or a tetravalent to hexavalent organic group; Y1 and Y2 are respectively aromatic organic groups or divalent to hexavalent aliphatic organic groups; m and n are molar ratio, and the sum of m and n is 100 mol%; and m is 1 to 99 mol%, and n is 1 to 99 mol%. |
