| 摘要 |
The present invention relates to a method for bonding two substrates (1, 2). The present invention comprises the following steps of applying a binder (4) to a first substrate (1); hardening the binder (4) partially; and applying a second substrate (2) to the binder (4), herein the second substrate is applied to the binder (4) before the binder (4) is completely stiffen. |
